This text focuses on the use of materials and the reliability issues associated with them and their interfaces. Included is a review of the key electrical, thermal, mechanical, chemical and various other properties and their significance in electronic packaging. Electronic packaging architectures are covered: Zeroth-level packaging materials; first-level; second level; and third level. The authors show how the levels of packaging or packaging architectures are used to classify materials and their performance over time.
This text focuses on the use of materials and the reliability issues associated with them and their interfaces. Included is a review of the key electr...
The authors of The Japanese Electronics Industry have pooled their div erse experience and talents to create a balanced, objective study of t his complex subject. They illuminate the history and characteristics o f the industry, show the current state of the industry, and explore th e research, development, and education vital to the future of the indu stry.
The authors of The Japanese Electronics Industry have pooled their div erse experience and talents to create a balanced, objective study of t his comp...
