The diminishing size and greater complexity of modern semiconductor integrated circuits poses new challenges in fault detection. Photon Emission Microscopy (PEM) is a physical fault localisation technique used for analysing IC failures. Detailing the PEM technique and its application to semiconductor device analysis, this unique reference:

• Illustrates the application of the PEM technique in various areas of device reliability, in particular hot-carrier, oxide and ESD reliability.
• Presents the principles of design and calibration for a...

Testing is usually the most expensive, time-consuming and difficult activity during the development of engineering products and systems. Development testing must be performed to ensure that designs meet requirements for performance, safety, durability, reliability, statutory aspects, etc. Most manufactured items must be tested to ensure that they are correctly made. However, much of the testing that is performed in industry is based upon traditions, standards and procedures that do not provide the optimum balance of assurance versus cost and time. There is often pressure to reduce testing...

This book includes an introduction to some important reliability concepts and a review of terminology. The work is divided into three sections: modelling, evaluation and assurance.

Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. Illustration of chip...

Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal.

Reliability engineers...