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Kategorie szczegółowe BISAC
 
Transport Simulation in Microelectronics

Alfred Kersch; William J. Morokoff
Computer simulation of semiconductor processing equipment and devices requires the use of a wide variety of numerical methods. Of these methods, the Monte Carlo approach is perhaps most fundamentally suited to mod eling physical events occurring on microscopic scales which are intricately connected to the particle structure of nature. Here physical phenomena can be simulated by following simulation particles (such as electrons, molecules, photons, etc. ) through a statistical sampling of scattering events. Monte Carlo is, however, generally looked on as a last resort due to the extremely slow...
Computer simulation of semiconductor processing equipment and devices requires the use of a wide variety of numerical methods. Of these methods, the M...
cena: 201,24
 
Modeling of Chemical Vapor Deposition of Tungsten Films

Chris R. Kleijn; Christoph Werner
Semiconductor equipment modeling has in recent years become a field of great interest, because it offers the potential to support development and optimization of manufacturing equipment and hence reduce the cost and improve the quality of the reactors. This book is the result of two parallel lines of research dealing with the same subject - Modeling of Tungsten CVD processes -, which were per- formed independently under very different boundary conditions. On the one side, Chris Kleijn, working in an academic research environment, was able to go deep enough into the subject to laya solid...
Semiconductor equipment modeling has in recent years become a field of great interest, because it offers the potential to support development and opti...
cena: 201,24
 
Three-Dimensional Simulation of Semiconductor Devices

Roland Kircher; Wolfgang Bergner
The three-dimensional device simulation has become a necessary tool for the design and investigation of complex device structures. The evolution of the three-dimensional simulation tools is directly linked to the scaling of the devices and the increasing complex- ity of dynamic random access memory (DRAM) cells. Scaling of MOSFET devices led to a three-dimensional geometry with effects which cannot be handled by two-dimensional simulations anymore. With increasing integration density in DRAMs the third dimen- sion had to be utilized to realize the storage capacitor. The result- ing leakage...
The three-dimensional device simulation has become a necessary tool for the design and investigation of complex device structures. The evolution of th...
cena: 124,11


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