This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of products.

High Temperature Electronics brings together essential information on the development of electronic components and packaging reliable to 200 degreeC and beyond and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate.level courses...