wyszukanych pozycji: 3
Remote Sensing for Monitoring Embankments, Dams, and Slopes: Recent Advances
ISBN: 9780784415726 Termin realizacji zamówienia: ok. 30 dni roboczych. Sponsored by the Embankments, Dams, and Slopes Technical Committee of the Geo-Institute of ASCE Remote Sensing for Monitoring Embankments, Dams, and Slopes: Recent Advances, GSP 322, provides information on selecting and deploying a monitoring network to assess the behavior, geometry, total and differential EDS movement, and potential risks of the EDS movement on people and infrastructure. Topics include general technologies used for EDS monitoring, selection and installation of networked sensors for predictive analytics and image recognition, application of monitoring techniques in the...
Sponsored by the Embankments, Dams, and Slopes Technical Committee of the Geo-Institute of ASCE Remote Sensing for Monitoring Embankments, Dams, an...
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cena:
526,56 zł |
Electronics Production Defects and Analysis
ISBN: 9789811698231 / Angielski / Twarda / 2022 Termin realizacji zamówienia: ok. 20 dni roboczych. This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The... This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defect... |
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cena:
500,03 zł |
Electronics Production Defects and Analysis
ISBN: 9789811698262 / Angielski / Miękka / 2023 Termin realizacji zamówienia: ok. 20 dni roboczych. This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The... This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defect... |
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cena:
346,16 zł |