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Please click here for information on Set 2: Thermal Packaging ToolsThermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems -- are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging,...

Micropumping has emerged as a critical research area for many electronics and biological applications. A significant driving force behind this research has been integration of pumping mechanisms into micro Total Analysis Systems ( TAS) or similar multi-functional analysis techniques. However, electronics packaging, micromixing and microdosing systems, among others, have also exploited micropumping concepts. This work commences with a comprehensive review of the recent advances in micropump technologies. Quantitative comparison tables of various micropumping techniques are listed as tabular...