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Research and development of logic synthesis and verification have matured considerably over the past two decades. Many commercial products are available, and they have been critical in harnessing advances in fabrication technology to produce today's plethora of electronic components. While this maturity is assuring, the advances in fabrication continue to seemingly present unwieldy challenges.
Logic Synthesis and Verification provides a state-of-the-art view of logic synthesis and verification. It consists of fifteen chapters, each focusing on a distinct aspect. Each chapter...

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The...

Research and development of logic synthesis and verification have matured considerably over the past two decades. Many commercial products are available, and they have been critical in harnessing advances in fabrication technology to produce today's plethora of electronic components. While this maturity is assuring, the advances in fabrication continue to seemingly present unwieldy challenges.
Logic Synthesis and Verification provides a state-of-the-art view of logic synthesis and verification. It consists of fifteen chapters, each focusing on a distinct aspect. Each chapter...