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Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. Emerging environmental regulations worldwide have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable Pb-free solders an important issue for microelectronics assembly. This book describes some properties of Sn-9Zn and Sn-8Zn-3Bi lead-free solders interacting with copper substrate. Some information are given on the wetting behavior, the interfacial reaction, mechanical properties and growth...

Practically all microelectronics assemblies in use utilize Sn-Pb eutectic solder for interconnections. Owing to worldwide environmental legislation to ban toxic materials in solder and demands for green products , a variety of lead-free solders have been developed. Sn-Ag-Cu solder is one of the most suitable candidates to replace lead solders. However, the performance of Sn-Ag-Cu alloys is not considered good enough to meet all needs to be for a solder material. To improve the solder material properties, a fourth element, Zn, is added into the solder alloy. This book describes some properties...