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wyszukanych pozycji: 5
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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications
ISBN: 9783319186740 / Angielski / Twarda / 2015 / 408 str. Termin realizacji zamówienia: ok. 20 dni roboczych. Three Dimensional Integration of Semiconductors
Three Dimensional Integration of Semiconductors
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cena:
385,52 zł |
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Cuprous is key to acceleration in Copper bottom up filling
ISBN: 9786202006347 / Angielski / Miękka / 2017 / 84 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. |
cena:
99,34 zł |
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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications
ISBN: 9783319792552 / Angielski / Miękka / 2019 / 408 str. Termin realizacji zamówienia: ok. 20 dni roboczych. This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - a...
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cena:
578,30 zł |
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Copper Electrodeposition for Nanofabrication of Electronics Devices
ISBN: 9781461491750 / Angielski / Twarda / 2013 / 282 str. Termin realizacji zamówienia: ok. 20 dni roboczych. This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: - ULSI wiring material based upon copper nanowiring - Printed circuit boards - Stacked semiconductors - Through Silicon Via - Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the ...
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cena:
385,52 zł |
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Copper Electrodeposition for Nanofabrication of Electronics Devices
ISBN: 9781493953738 / Angielski / Miękka / 2016 / 282 str. Termin realizacji zamówienia: ok. 20 dni roboczych. This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: - ULSI wiring material based upon copper nanowiring - Printed circuit boards - Stacked semiconductors - Through Silicon Via - Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the ...
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cena:
308,41 zł |
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