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2nd Edition. The almost exponential increase in density, complexity, and performance of integrated circuits over the past ten years (for example, ASIC (Application Specific Integrated Circuit), VHSIC (Very High Speed IC), VLSIC (Very Large Scale IC), and ULSIC (Ultra Large Scale IC) have driven developments in the interconnect substrates culminating in what is now known as multichip modules (MCM). However, the fundamental of design, fabrication, and testing of MCM's are essentially the same as hybrid microcircuits. In the authors' opinion MCM's are extensions of hybrid circuits that can...

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.

The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this...