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The exploitation of MicroElectroMechanical-Systems for Radio Frequency applications (RF-MEMS) has been attracting the interest of the Scientific Community through the past decade, because of its potentialities in terms of high-performance and large reconfigurability it can enable in transceiver platform (e.g. in satellites, radars, mobile phones). This work addresses two critical issues leading to the successful exploitation of RF-MEMS technology, namely the modeling of their multi-physical behaviour (electromechanical and electromagnetic) and the packaging/encapsulation of such devices to...