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The inclusion of nanoparticles in the lead free solder, the trajectory of the nanoparticles throughout the soldering process needs to be monitored since it will influence the formation of the fillet height, inter-metallic compound (IMC) layer and micro-void formation. A two way interactions utilizing both volume of fluid method (VOF) and discrete phase method (DPM) are introduced in the current study to account for the interaction between both the nanoparticles and the molten solder. The nano-reinforced particles that are introduced in the SAC305 solder are titanium oxide (TiO2), Nickel oxide...