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wyszukanych pozycji: 7
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
ISBN: 9780367635886 / Angielski Termin realizacji zamówienia: ok. 22 dni roboczych (Bez gwarancji dostawy przed świętami) |
cena:
277,99 zł |
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Human-in-the-Loop: Probabilistic Modeling of an Aerospace Mission Outcome
ISBN: 9780815354550 / Angielski / Twarda / 2018 / 225 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Bez gwarancji dostawy przed świętami) "A CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T&F Informa plc."
"A CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T&F Informa plc."
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cena:
804,84 zł |
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Human-In-The-Loop: Probabilistic Modeling of an Aerospace Mission Outcome
ISBN: 9780367781354 / Angielski / Miękka / 2021 / 225 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Bez gwarancji dostawy przed świętami) |
cena:
238,96 zł |
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Structural Analysis in Microelectronic and Fiber-Optic Systems: Volume I Basic Principles of Engineering Elastictiy and Fundamentals of Structural Ana
ISBN: 9789401165372 / Angielski / Miękka / 2012 / 418 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Bez gwarancji dostawy przed świętami) This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been...
This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mec...
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cena:
201,72 zł |
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
ISBN: 9781138624733 / Angielski / Twarda / 2021 / 382 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Bez gwarancji dostawy przed świętami) |
cena:
756,05 zł |
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Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechan
ISBN: 9780387279749 / Angielski / Twarda / 2006 / 1460 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Bez gwarancji dostawy przed świętami) Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how... Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensiv... |
cena:
2017,53 zł |
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Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechan
ISBN: 9781489978851 / Angielski / Miękka / 2016 / 1460 str. Termin realizacji zamówienia: ok. 22 dni roboczych (Bez gwarancji dostawy przed świętami) |
cena:
2017,53 zł |
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