wyszukanych pozycji: 5
Bondkontakte
ISBN: 9783112573273 / Niemiecki / Twarda / 1991 / 196 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
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cena:
472,70 zł |
Materials for Information Technology: Devices, Interconnects and Packaging
ISBN: 9781849969673 / Angielski / Miękka / 2010 / 508 str. Termin realizacji zamówienia: ok. 20 dni roboczych (dostawa w 2025) This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries. This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought b... |
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cena:
769,29 zł |
Materials for Information Technology: Devices, Interconnects and Packaging
ISBN: 9781852339418 / Angielski / Twarda / 2005 / 508 str. Termin realizacji zamówienia: ok. 20 dni roboczych (dostawa w 2025) This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries. This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought b... |
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cena:
769,29 zł |
Characterization of Nanomaterials
ISBN: 9783036507569 / Angielski / Twarda / 2021 / 140 str. Termin realizacji zamówienia: ok. 13-18 dni roboczych. |
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cena:
237,92 zł |
Advanced Interconnects for ULSI Technology
ISBN: 9780470662540 / Angielski / Twarda / 2012 / 608 str. Termin realizacji zamówienia: ok. 22 dni roboczych (dostawa w 2025) Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.
"Advanced Interconnects for ULSI Technology" is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical... Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects hav...
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cena:
860,24 zł |