wyszukanych pozycji: 6
![]() |
Wafer Level 3-D ICS Process Technology
ISBN: 9780387765327 / Angielski / Twarda / 2008 / 410 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In...
Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry s vexing problems: heterogeneous integration a...
|
cena:
606,65 |
![]() |
Wafer Level 3-D ICS Process Technology
ISBN: 9781441945624 / Angielski / Miękka / 2010 / 410 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In...
Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry s vexing problems: heterogeneous integration a...
|
cena:
606,65 |
![]() |
Advances in 3D Integrated Circuits and Systems
ISBN: 9789814699013 / Angielski / Miękka / 2015 / 392 str. Termin realizacji zamówienia: ok. 30 dni roboczych. 3D integration is an emerging technology for the design of many-core microprocessors and memory integration.
3D integration is an emerging technology for the design of many-core microprocessors and memory integration.
|
cena:
236,05 |
![]() |
Stress Concentrations in Laminated Composites
ISBN: 9781566760775 / Angielski / Miękka / 1994 / 482 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. From the Author's Preface
The objective of this book is to provide a thorough and systematic study of the problem of laminated composites containing stress concentrations. Stress concentrations are introduced in laminated plates in the forms of circular holes, elliptical openings and straight cracks. These forms of cutouts have many practical applications, and are familiar to most engineers. Stress concentrations exist in all known structural components. Stress concentrations have great practical importance because they are normally the cause of failure. In addition to stress analyses... From the Author's Preface
The objective of this book is to provide a thorough and systematic study of the problem of laminated composites containi... |
cena:
1352,36 |
![]() |
Advances in 3D Integrated Circuits and Systems
ISBN: 9789814699006 / Angielski / Twarda / 2015 / 392 str. Termin realizacji zamówienia: ok. 30 dni roboczych. |
cena:
614,71 |
![]() |
Physical Design for 3D Integrated Circuits
ISBN: 9781498710367 / Angielski / Twarda / 2015 / 397 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the desig... |
cena:
860,59 |