wyszukanych pozycji: 6
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Fabless Semiconductor Manufacturing: In the Era of Internet of Things
ISBN: 9789814968270 / Angielski / Twarda / 2022 / 324 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
cena:
568,13 |
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Computer Aided Design of Micro- And Nanoelectronic Devices
ISBN: 9789814713078 / Angielski / Twarda / 2017 / 464 str. Termin realizacji zamówienia: ok. 30 dni roboczych. |
cena:
710,17 |
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Selected Works of Professor Herbert Kroemer
ISBN: 9789812709011 / Angielski / Twarda / 2008 / 384 str. Termin realizacji zamówienia: ok. 30 dni roboczych. Information technology has changed our society radically. Just as the integrated circuits have been the prime mover for electronics, high-speed transistors and semiconductor lasers based on heterostructures are now playing the same role in modern telecommunications. Professor Kroemer's conceptual work on heterostructures began in the early 1950s as he was looking for a way to improve transistor speed and performance. In the 1960s, he applied the same principles to the development of lasers and light-emitting diodes, showing that they could achieve continuous operation at room temperature -...
Information technology has changed our society radically. Just as the integrated circuits have been the prime mover for electronics, high-speed transi...
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cena:
778,74 |
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Stress and Strain Engineering at Nanoscale in Semiconductor Devices
ISBN: 9780367519292 / Angielski / Twarda / 2021 / 260 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
cena:
832,62 |
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Introducing Technology Computer-Aided Design (Tcad): Fundamentals, Simulations, and Applications
ISBN: 9789814745512 / Angielski / Twarda / 2017 / 422 str. Termin realizacji zamówienia: ok. 22 dni roboczych. This might be the first book that deals mostly with the 3D technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including design for manufacturing (DFM), and from device modeling to SPICE parameter extraction. This book offers an innovative and new approach toward the teaching of the fundamentals of semiconductor process and device design using advanced TCAD simulations of various semiconductor structures. This might be the first book that deals mostly with the 3D technology computer-aided design (TCAD) simulations of stress- and strain-engineered adv... |
cena:
484,83 |
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Stress and Strain Engineering at Nanoscale in Semiconductor Devices
ISBN: 9780367519339 / Miękka / 2023 / 260 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
cena:
303,61 |