wyszukanych pozycji: 14
Nanoscale Devices: Physics, Modeling, and Their Application
ISBN: 9780367570729 / Angielski / Miękka / 2020 / 452 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. |
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cena:
207,43 zł |
Organic Thin-Film Transistor Applications: Materials to Circuits
ISBN: 9781498736534 / Angielski / Twarda / 2016 / 351 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Text provides information about advanced OTFT (Organic thin film transistor) structures, their modeling and extraction of performance parameters, materials of individual layers, their molecular structures, basics of pi-conjugated semiconducting materials and their properties, OTFT charge transport phenomena and fabrication techniques. It includes applications of OTFTs such as single and dual gate OTFT based inverter circuits along with bootstrap techniques, SRAM cell designs based on different material and circuit configurations, light emitting diodes (LEDs). Besides this, application of... Text provides information about advanced OTFT (Organic thin film transistor) structures, their modeling and extraction of performance parameters, m... |
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cena:
700,25 zł |
Nanoelectronics: Devices, Circuits and Systems
ISBN: 9780128133538 / Angielski / Miękka / 2018 / 476 str. Termin realizacji zamówienia: ok. 18-20 dni roboczych. |
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cena:
715,81 zł |
Through Silicon Vias: Materials, Models, Design, and Performance
ISBN: 9781498745529 / Angielski / Twarda / 2016 / 216 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based... Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silico... |
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cena:
933,66 zł |
VLSI Design and Test: 21st International Symposium, Vdat 2017, Roorkee, India, June 29 - July 2, 2017, Revised Selected Papers
ISBN: 9789811074691 / Angielski / Miękka / 2017 / 815 str. Termin realizacji zamówienia: ok. 20 dni roboczych. This book constitutes the refereed proceedings of the 21st International Symposium on VLSI Design and Test, VDAT 2017, held in Roorkee, India, in June/July 2017. The 48 full papers presented together with 27 short papers were carefully reviewed and selected from 246 submissions.
This book constitutes the refereed proceedings of the 21st International Symposium on VLSI Design and Test, VDAT 2017, held in Roorkee, India, in June...
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cena:
384,63 zł |
Nanoscale Devices: Physics, Modeling, and Their Application
ISBN: 9781138060340 / Angielski / Twarda / 2018 / 432 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. |
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cena:
674,31 zł |
Carbon Nanotube Based VLSI Interconnects: Analysis and Design
ISBN: 9788132220466 / Angielski / Miękka / 2014 / 86 str. Termin realizacji zamówienia: ok. 20 dni roboczych. The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and...
The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled ...
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cena:
192,30 zł |
Organic Thin-Film Transistor Applications: Materials to Circuits
ISBN: 9780367574611 / Angielski / Miękka / 2020 / 351 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. |
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cena:
238,55 zł |
Recent Trends in Communication and Electronics: Proceedings of the International Conference on Recent Trends in Communication and Electronics (Icce-20
ISBN: 9781032045726 / Angielski / Twarda / 2021 / 560 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. |
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cena:
907,73 zł |
Spacer Engineered Finfet Architectures: High-Performance Digital Circuit Applications
ISBN: 9780367573553 / Angielski / Miękka / 2020 / 138 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. |
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cena:
238,55 zł |
Spacer Engineered Finfet Architectures: High-Performance Digital Circuit Applications
ISBN: 9781498783590 / Angielski / Twarda / 2017 / 138 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. This book focusses on the spacer engineering aspects of novel MOS-based device-circuit co-design in sub-20nm technology node, its process complexity, variability, and reliability issues. It comprehensively explores the FinFET/tri-gate architectures with their circuit/SRAM suitability and tolerance to random statistical variations. This book focusses on the spacer engineering aspects of novel MOS-based device-circuit co-design in sub-20nm technology node, its process complexit... |
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cena:
700,25 zł |
Biosensors: Nanomaterials, Approaches, and Performance-Enhancement Strategies
ISBN: 9781394268207 / Angielski Termin realizacji zamówienia: ok. 22 dni roboczych. |
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cena:
595,14 zł |
Through Silicon Vias: Materials, Models, Design, and Performance
ISBN: 9780367574543 / Angielski / Miękka / 2020 / 216 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. |
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cena:
238,55 zł |
Introduction to Microelectronics to Nanoelectronics
ISBN: 9780367503246 / Miękka / 2023 / 328 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. |
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cena:
238,55 zł |