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The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking...

Photomasks are defect-free optical templates -- the printing masters for the fabrication of integrated circuits (ICs). When IC feature sizes fall below the exposure tool's source wavelength, photomask fabrication becomes difficult: very strict mask critical dimension (CD) and feature placement specifications, intensive capital equipment investment, unique raw materials and applications, and special expertise requirements for photomask fabrication technologists are necessary to fabricate modern microelectronics. Thus the rapid recent growth of the field and the need for this book. This text...