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The industry of electronic packaging is fast moving towards lead-free solders because of environmental and health concerns. Among the various surface finishes available, electroless nickel/ immersion gold (ENIG) is the most appealing at the moment. Unfortunately, the presence of phosphorus (P) may complicate the interfacial reactions and may affect the reliability of the solder joint. In order to minimise this problem, an alternative surface finish were introduced, in which a layer of palladium is introduced between the nickel and gold layers using electroless deposition. This book...

This study presents a numerical investigation on the deformation of the circular blanket against a male die under impulsive loading to form a torispherical heads shape. A finite element model was developed and verified with experimental tests for the explosive forming of the torispherical heads made of AA5083 aluminum alloy in the framework of LS-DYNA crash simulator software. The nature of the deformation was turned from the stretching to the buckling and compression across the specimen by using a male die, which is a novel concept in the high speed forming processes. Johnson-Cook (JC) and...