wyszukanych pozycji: 3
Design for Manufacturability: From 1d to 4D for 90-22 NM Technology Nodes
ISBN: 9781461417606 / Angielski / Twarda / 2013 / 278 str. Termin realizacji zamówienia: ok. 20 dni roboczych. This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.
This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM pr...
|
|
cena:
387,30 zł |
Semiconductors: Integrated Circuit Design for Manufacturability
ISBN: 9781439817148 / Angielski / Twarda / 2011 / 248 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That s why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing.... Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are... |
|
cena:
989,32 zł |
Design for Manufacturability: From 1d to 4D for 90-22 NM Technology Nodes
ISBN: 9781493943425 / Angielski / Miękka / 2016 / 278 str. Termin realizacji zamówienia: ok. 20 dni roboczych. This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.
This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM pr...
|
|
cena:
398,15 zł |