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The research work aims at analyzing the heat transfer rate of the nano particles with different type of heat exchanger. Graphene, the nano particle under consideration, can be prepared using Hummers and Offeman method. The analysis has been done with the help of Ansys Fluent software. The physical properties (density, thermal conductivity, specific heat, viscosity) of the nano particles are taken from a standard journal and analyzed in a double tube and triple tube heat exchanger with the given dimensions. The simulation is done using the Ansys fluent for a particular concentration of...

Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. In particular, this book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes...

Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage of the methodology and the latest technical innovations.