Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

ISBN-13: 9783527352425 / Angielski / Twarda / 2023 / 368 str.

X Tian;Xingyou Tian

Opis

Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.

Spis treści

OVERVIEW OF WORKSPHYSICAL BASIS OF THERMAL CONDUCTIONBasic Concepts and Laws of Thermal ConductionHeat Conduction Differential Equation and Finite SolutionHeat Conduction Mechanism and Theoretical CalculationThermal Conductivity of SolidsELECTRONIC PACKAGING MATERIALS FOR THERMAL MANAGEMENTDefinition and Classification of Electronic PackagingThermal Management in Electronic EquipmentRequire of Electronic Packaging MaterialsElectronic Packaging MaterialsCHARACTERIZATION METHODS FOR THERMAL MANAGEMENT MATERIALSOverview of the Development of Thermal Conductivity Test MethodsTest Method Classification and StandardsSteady-State MethodNon-Steady-State MethodElectrical Properties and Measurement TechniquesMaterial Characterization Analysis TechnologyReliability Analysis and Environmental Performance EvaluationCONSTRUCTION OF THERMAL CONDUCTIVITY NETWORK AND PERFORMANCE OPTIMIZATION OF POLYMER SUBSTRATESynthesis and Surface Modification of High Thermal Conductive Filler and the Synthesis of SubstratesStudy on Polymer Thermal Conductive Composites with Oriented StructurePreparation of Thermal Conductive Composites with Inorganic Ceramic Skeleton StructureAssembly of Thermal Conductive Materials in Different Dimensions and Preparation of Composite MaterialsConclusionOPTIMAL DESIGN OF HIGH THERMAL CONDUCTIVE METAL SUBSTRATE SYSTEM FOR HIGH POWER DEVICESPower Devices and Thermal ConductionOptimization and Adaptability Design, Preparation and Modification of High Thermal Conductive Matrix and ComponentsFormation and Evolution Rules of High Thermal Conductive Interface and its Control MethodFormation and Evolution Rules of High Thermal Conductive Composite Microstructure and its Control MethodPREPARATION AND PERFORMANCE STUDY OF SILICON NITRIDE CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITYRapid Nitridation of Silicon Compact and Tape Casting of SiliconOptimization of Sintering Aids for High Thermal Conductivity Si3N4 CeramicsInvestigation of Cu-Metalized Si3N4 Substrates via Active Metal Brazing (AMB) MethodPREPARATION AND PROPERTIES OF THERMAL INTERFACE MATERIALSConception of Thermal Interface MaterialsPolymer Based Thermal Interface MaterialsMetal Based Thermal Interface MaterialsCarbon Based Thermal Interface MaterialsMolecular Simulation Study of Interfacial Thermal TransferSTUDY ON SIMULATION OF THERMAL CONDUCTIVE COMPOSITE FILLING THEORYMolecular Simulation Algorithms for Thermal Conductivity CalculatingMolecular Simulation Study on PolymersMolecular Simulation Study on TC of Si3N4 CeramicsMolecular Simulation Study on TC of Diamond/Copper CompositesSimulation Study on Polymer-Based CompositesMARKET AND FUTURE PROSPECTS OF HIGH THERMAL CONDUCTIVITY COMPOSITE MATERIALSBasic Concept of Composite MaterialsThermal Conductivity Mechanism and Thermal Conductivity ModelComposite Materials in Electronic DevicesThermal Functional CompositesThe Modification of Composite MaterialsThe New Packaging MaterialThermal Management of Electronic DevicesMethods for Improving Thermal Conductivity of Composite MaterialsThe Application of Composite MaterialsConclusions

O autorze

Professor Xingyou Tian is Deputy Director of Institute for Solid State Physics (ISSP), Hefei Institutes of Physical Science, Chinese Academy of Sciences and Director of the Key Laboratory of Photovoltaic and Energy-Saving Materials of the Chinese Academy of Sciences. His main research include key functional materials for electronic devices, integrated circuit heat dissipation materials, polymer nanocomposite materials, and new energy-saving and environmentally friendly materials.