Polymeric Materials for Electronic Packaging

ISBN-13: 9781394188796 / Angielski / Twarda / 2023 / 250 str.

Shozo Nakamura

Opis

POLYMERIC MATERIALS FOR ELECTRONIC PACKAGING Create and deploy reliable polymeric materials for use in electronic products with this comprehensive guide Modern electronic products are manufactured at a finer scale and with more precision than ever before. This places increasing demand on the proper use and management of high-performance polymers to create reliable, rapidly-operating semiconductor products. Understanding the physical properties and viscoelasticity analysis of resins is essential for engineers and researchers to perfect and deploy these polymers in electronics contexts. Polymeric Materials for Electronic Packaging is designed to meet this specific need with a thorough introduction to these materials and their production. It provides the tools engineers need to reduce processing times and increase durability in their semiconductor packages and products. Translated from the Japanese original and offering in-depth analysis from a global-leading expert, this promises to be an indispensable volume. Polymeric Materials for Electronic Packaging readers will also find: Detailed treatment of subjects including viscoelastic theory, design issues of LSI packages, and more Analysis uniquely suited to the dimensions of cutting-edge semiconductor technology Incorporation of cutting-edge viscoelasticity analysis software, available separately from the author Polymeric Materials for Electronic Packaging is critical for electrical and electronics engineers working with semiconductors, as well as advanced postgraduate students and researchers in this or numerous related areas.

Spis treści

PrefaceChapter 1 Basics of Semiconductor1.1 Development of semiconductors1.2 Analysis of semiconductor materialsChapter 2 Basics of Polymer Materials2.1 Polymer material2.2 Types and classification of polymer materials2.3 General properties of polymer materials2.4 SummaryChapter 3 Basic of elastic Theory3.1 Elastic and elastic body3.2 Stress and strain3.3 Finite element analysis (FEM analysis)3.4 Governing equation of elastic body3.5 Law of elastic breakage3.6 Plane stress and plane strainChapter 4 Stress evaluations of materials4.1 Difference from strength of materials4.2 Stress concentration and stress intensity factorChapter 5 Basics of Viscoelasticity5.1 About viscosity5.2 Elasticity and viscosity and viscoelasticity5.3 Stress and strain response5.4 Mechanical model representing viscoelastic properties5.5 Conceptual formula for creep and stress relaxation5.6 Master curve and time-temperature conversion Rule5.7 Approximation of master curve5.8 Superposition principle and basic equations5.9 Principle of generation of thermal stress and StrainChapter 6 Measurement of viscoelastic properties6.1 Dynamic viscoelasticity6.2 Measurement method6.3 Complex modulus and mechanical model6.4 Dispersion and absorption by frequency6.5 Actual measurement exampleChapter 7 Design issues of LSI packages7.1 Introduction7.2 Trends and issues of LSI packagesChapter 8 Validity of viscoelastic VESAP analysis8.1 Introduction8.2 Structure of laminated body8.3 Analysis method8.4 Colling experiment of laminated body8.5 Analysis results and experimental values8.6 ConclusionChapter 9 Application to CSP-µBGA9.1 Introduction9.2 Structure and modeling of CSP-µBGA9.3 Material property values used for analysis9.4 Material and structure optimization by VESAP analysisChapter10 Thermal stress and warpage behavior during cooling process10.1 Introduction10.2 Structure of LSI package10.3 Three-layer viscoelastic laminate model10.4 Elucidation of warpage deformation behavior by VESAP analysisChapter 11 Warp deformation behavior from heating To cooling11.1 Introduction11.2 Two-layer laminate with epoxy resin / FR-4 Substrate11.3 Three-layer laminate of metal / epoxy resin / FR-4 substrate11.4 Analysis and experiment of four-layer laminateChapter12 Warp deformation prediction method considering curing shrinkage of resin12.1 Introduction12.2 Examination procedure and way of thinking12.3 Contents of VESAP analysis12.4 Simple prediction formula for calculating curing warpage12.5 Warp deformation experiment12.6 Theoretical prediction of warpage deformation due to hardening and heatChapter 13 Changes in material properties and warpage deformation behavior due to thermal degradation13.1 Purpose and background13.2 Experimental of case I13.3 Experimental of case IIChapter 14 Simple evaluation method for warp deformation of viscoelastic body14.1 Introduction14.2 Derivation of simple formula14.3 Practical method14.4 Determining the curing temperature of the resin14.5 Effect of epoxy resin thickness on heat generation temperature14.6 ConclusionChapter 15 Effect of cooling rate on warpage deformation of laminates15.1 Warp deformation experiment15.2 VESAP analysis15.3 Final warp deformation amount and residual Warp deformation amount15.4 ConclusionAppendixDevelopment of viscoelastic analysis Software (VESAP)1. Development needs and concepts2. Derivation of basic formula3. Contents of the developed VESAP softwareName indexSubject index

O autorze

Shozo Nakamura, PhD, is Professor Emeritus at the Hiroshima Institute of Technology, Japan, and a sought-after corporate technical adviser. In 2019, he established the Nakamura Technical Research Institute.