Modeling and Application of Flexible Electronics Packaging

ISBN-13: 9789811336263 / Angielski / Twarda / 2019 / 287 str.

Yongan Huang; Zhouping Yin; Xiaodong Wan

Spis treści

Advanced Electronics Packaging.- Interfacial Modeling of Flexible Multilayer Structures.- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy.- Shear-Assisted Peeling.- Single-Needle Peeling.- Multi-Needle Peeling.- Conformal Peeling.- Laser Lift-Off.- Vacuum-Based Picking-up and Placing-on.

O autorze

YongAn Huang received the B.S. and M.S. degrees in Civil Engineering and the Ph.D. degree in Engineering Mechanics from Northwestern Polytechnical University, Xi’an, China, in 2001, 2004, and 2007, respectively. He was a Postdoctoral Fellow with the School of Mechanical Science and Engineering, Huazhong University of Science and Technology,  (HUST), Wuhan, China, in 2007. He is currently a Professor of the State Key Laboratory of Digital Manufacturing Equipment and Technology, HUST. His current research interests include flexible electronics manufacturing and advanced material. Dr. Huang was awarded the Young Top-Notch Talent of “Ten Thousand Talent Program” of China in 2014. He was appointed as the Changjiang Young Scholar from Ministry of Education of China in 2016. He received the National Science Fund for Excellent Young Scholars of China.

Zhouping Yin received the B.S. and Ph.D. degrees in mechanical engineering from Huazhong University of Science and Technology (HUST), Wuhan, China, in 1994 and 2000, respectively. He is a Distinguished Professor and has been the Vice Head of the State Key Laboratory of Digital Manufacturing Equipment and Technology, HUST, since 2005. He is a Principal Investigator for projects sponsored by the General Program and Major Program of the National Science Foundation and the National Basic Research Project of China. He is leading a research group and conducting research in the electronic manufacturing equipment and technology, including printed electronics and radio frequency identification packaging. Dr. Yin was appointed as the Changjiang Distinguished Professor from Ministry of Education of China in 2009. He received the National Science Fund for Distinguished Young Scholars of China.

Xiaodong Wan received his B.S. and Ph.D. degrees in engineering mechanics from Huazhong University of Science and Technology (HUST), Wuhan, China, in 2012 and 2016, respectively. He is currently a Postdoctoral Fellow at the School of Mechanical Science and Engineering, HUST. His research interests include flexible electronics manufacturing and laser processing. Dr. Wan received the Young Scientists Fund of the National Natural Science Foundation of China. 

Blurb

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.