Distributed CMOS Bidirectional Amplifiers: Broadbanding and Linearization Techniques

ISBN-13: 9781489986566 / Angielski / Miękka / 2014 / 134 str.

Ziad El-Khatib; Leonard Maceachern; Samy a. Mahmoud

Opis

This book describes methods to design distributed amplifiers useful for performing circuit functions such as duplexing, paraphrase amplification, phase shifting power splitting and power combiner applications. A CMOS bidirectional distributed amplifier is presented that combines for the first time device-level with circuit-level linearization, suppressing the third-order intermodulation distortion. It is implemented in 0.13um RF CMOS technology for use in highly-linear, low-cost UWB Radio-over-Fiber communication systems.

Spis treści

Introduction.- Modulation Schemes Effect on RF Power Amplifier Nonlinearity and RFPA Linearization Techniques.- Distributed Amplification Principles and Transconductor Nonlinearity Compensation.- Distributed RF Linearization Circuit Applications.- Linearized CMOS Distributed Bidirectional Amplifier with Cross-Coupled Compensator.- Linearized CMOS Distributed Bidirectional Amplifier Silicon Chip Implementation.- Linearized CMOS Distributed Bidirectional Amplifier Experimental Setups and Chip Measurement Results.- Conclusion.

Blurb

This book describes methods to design distributed amplifiers useful for performing circuit functions such as duplexing, paraphrase amplification, phase shifting power splitting and power combiner applications.  A CMOS bidirectional distributed amplifier is presented that combines for the first time device-level with circuit-level linearization, suppressing the third-order intermodulation distortion. It is implemented in 0.13μm RF CMOS technology for use in highly linear, low-cost UWB Radio-over-Fiber communication systems.

• Describes CMOS distributed amplifiers for optoelectronic applications such as Radio-over-Fiber systems, base station transceivers and picocells;
• Presents most recent techniques for linearization of CMOS distributed amplifiers;
• Includes coverage of CMOS I-V transconductors, as well as CMOS on-chip inductor integration and modeling;
• Includes circuit applications for UWB Radio-over-Fiber networks.