Batteryless MM-Wave Wireless Sensors

ISBN-13: 9783319892269 / Angielski / Miękka / 2019 / 138 str.

Hao Gao; Marion Matters-Kammerer; Dusan Milosevic

Spis treści

Chapter 1.Introduction.- Chapter 2.State of the art.- Chapter 3.System analysis of mm-wave wireless sensor networks.- Chapter 4.Recti er analysis.- Chapter 5.mm-Wave recti ers.- Chapter 6.mm-Wave monolithic integrated sensor nodes.- Chapter 7.-Wave low-power receiver.- Chapter 8.mm-Wave front-end design for phased array systems.- Chapter 9. Conclusion.

O autorze

Hao Gao is an Assistant Professor in the Department of Electrical Engineering Eindhoven University of Technology, in The Netherlands. He received the B.Eng. degree from Southeast University, Nanjing, China, M.Sc from Delft University of Technology, Delft, The Netherlands and Ph.D. degree from Eindhoven University of Technology, Eindhoven, The Netherlands, in 2006, 2008 and 2015 respectively. In 2012, he was a European Marie Curie Researcher in Catena Wireless Electronics, Stockholm, Sweden. In 2014, he became a research scientist at Delft University of Technology, The Netherlands. Since 2106, he is an assistant professor at mixed-signal microelectronics group, Eindhoven University of Technology, involved in the area of RF and microwave research. He has received several awards including co-recipient of ISSCC 2015 Distinguished-Technical-Paper Award.

Marion Matters-Kammerer is a Professor in the Department of Electrical Engineering Eindhoven University of Technology, in The Netherlands. She received the B.S. degree and Master of physics degree from the Ecole Normale Supérieure, Paris, France, in 1997 and 1998, respectively, the Physikdiplom degree from the Technical University of Berlin, Berlin, Germany, in 1998, and the Ph.D. in physics from RWTH Aachen, Aachen, Germany, in 2006. In 1999, she joined Philips Research Aachen, Aachen, Germany. In 2004, she joined Philips Research Eindhoven, Eindhoven, The Netherlands. In 2009 and 2010, she was a Lecturer and Guest Researcher with the Faculty of Electrical Engineering, RWTH Aachen, Aachen, Germany. Since 2011, she has been with the Technical University of Eindhoven, Eindhoven, The Netherlands, where she is involved in the area of electronic modules for terahertz imaging and spectroscopy, as well as ultra-high-speed circuits.

Dusan Milosevic is an Assistant Professor in the Department of Electrical Engineering Eindhoven University of Technology, in The Netherlands. He received the M.S. degree in electronics and telecommunications engineering from the University of Nis, Serbia, in 2001, and the Ph.D. degree in electrical engineering from Eindhoven University of Technology, The Netherlands, in 2009. Since 2001 he has been with Eindhoven University of Technology. His research interests include RF and microwave power amplifiers and ultra-low power RF front ends.

Peter Baltus was born on July 5th 1960 in Sittard and received his masters degree in Electrical Engineering from Eindhoven University of Technology in 1985, and his PhD degree from the same university in 2004. He worked for 22 years at Philips and later NXP in Eindhoven, Nijmegen, Tokyo and Sunnyvale in various functions, including research scientist, program manager, architect, domain manager, group leader and fellow in the areas of data converters, microcontroller architecture, digital design, software, and RF circuits and systems.  In 2007 he started his current job at the Eindhoven University of Technology as professor in high-frequency electronics. From 2007 through 2016 he was director of the Centre for Wireless Technology and as of 2017 he is chair of the mixed-signal micro-electronics group. He co-authored more than 150 papers and holds 17 US patents.

Blurb

This book describes the PREMISS system, which enables readers to overcome the limitations of state-of-the-art battery-less wireless sensors in size, cost, robustness and range, with a system concept for a 60 GHz wireless sensor system with monolithic sensors.  The authors demonstrate a system in which the wireless sensors consist of wireless power receiving, sensing and communication functions in a single chip, without external components, avoiding costly IC-interfaces that are sensitive to mechanical and thermal stress.