Kategoria BISAC: Technology & Engineering >> Electronics - Microelectronics

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Integrating physical modeling, mathematical analysis, and computer simulation, Instrumentation Design Studies explores a wide variety of specific and practical instrumentation design situations. The author uses MATLAB? and SIMULINK? for dynamic system simulation, Minitab? for statistical applications, and Mathcad for general engineering computations. Rather than consult the extensive manuals of these software packages, readers can access handy, sharply focused material in the appendices to assist in comprehension.

After introducing the techniques behind the design of experiments (DOE),...

"Electrical Conductive Adhesives with Nanotechnologies" begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of...

The Electromagnetic Compatibility has become an increasingly essential factor for placing a product on the global, world wide market.

Fulfilling emission limits and immunity requirements as well as handling apparently complex cases of incompatibility demands a deeper understanding of the physical interrelations and of Maxwell's theory.

Based on the authors experiences, the textbook provides some help in solving such interferential cases.

It contains many illustrative examples and more than 80 exercises with solutions.

Multiobjective Shape Design in Electricity and Magnetism is entirely focused on electric and magnetic field synthesis, with special emphasis on the optimal shape design of devices when conflicting objectives are to be fulfilled. Direct problems are solved by means of finite-element analysis, while evolutionary computing is used to solve multiobjective inverse problems. This approach, which is original, is coherently developed throughout the whole manuscript. The use of game theory, dynamic optimisation, and Bayesian imaging strengthens the originality of the book. Covering the development...

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today 's information industry. The packaging process including design and manufacturing technologies is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems.

Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless,...

* Explains in depth the many recent i

This Special Issue titled "Recent Advances in Sensing Technology" in the book series of "Lecture Notes in Electrical Engineering" contains the extended version of the papers selected from those that were presented at the 3^rd International Conference on Sensing Technology (ICST 2008) which was held in November 30 to December 3, 2008 at National Cheng-Kung University, Tainan, Taiwan. A total of 131 papers were presented at ICST 2008, of which 19 papers have been selected for this special issue.

This Special Issue has focussed on the recent advancements of the different...

This book presents the hardware implementation of control algorithms represented by graph-schemes of algorithm. It includes new methods of logic synthesis and optimization for logic circuits of Mealy and Moore FSMs oriented on both ASIC and FPLD.

The collaboration and research that was developed to produce the MIT Gas Turbine Engine are described in this book. Both the engine and generator are fabricated from silicon using a combination of bulk and surface microfabrication technologies. The book discusses the technical details that have gone into producing the engine and the overall systems-level tradeoffs, in particular its motor compressors and turbine generators, and the decisions that have been made.

Innovations and Advances in Computer Sciences and Engineering includes a set of rigorously reviewed world-class manuscripts addressing and detailing state-of-the-art research projects in the areas of Computer Science, Software Engineering, Computer Engineering, and Systems Engineering and Sciences.

Innovations and Advances in Computer Sciences and Engineering includes selected papers form the conference proceedings of the International Conference on Systems, Computing Sciences and Software Engineering (SCSS 2008) which was part of the International Joint Conferences on Computer,...

Advances in Imaging and Electron Physics merges two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy.

This series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

• Contributions from leading international scholars and industry...

Covers advances in the field of computer techniques and algorithms in digital signal processing.

Here, Dominique Paret offers you a complete guide to the theory, components, practical application areas and standards in RFID at UHF and SHF. He achieves an expert balance between theory and technology, finance and other aspects, providing a clear view of the entire field.

This book deals with the real aspects of contactless...

This book is ideal for those practicing engineers, advanced students, and PIC enthusiasts that want to incorporate SD Cards into their devices. SD cards are cheap,...