Kategoria BISAC: Technology & Engineering >> Electronics - Microelectronics

Looking back when the International Forum on Advanced Microsystems for Automotive Application (AMAA) started, enormous progress has been made in reducing casualties, emissions and in increasing comfort and performance. Microsystems in many cases provided the key functions for this progress. Although the issues the event concentrated on didn t change significantly (safety, powertrain, comfort, etc.), considerable shifts of technological paradigms and approaches can be stated.

The future of microsystems will consist of integrated smart systems which are able to diagnose a situation,...

Low Power UWB CMOS Radar Sensors deals with the problem of designing low cost CMOS radar sensors. The radar sensor uses UWB signals in order to obtain a reasonable target separation capability, while maintaining a maximum signal frequency below 2 GHz. This maximum frequency value is well within the reach of current CMOS technologies. The use of UWB signals means that most of the methodologies used in the design of circuits and systems that process narrow band signals, can no longer be applied.

Low Power UWB CMOS Radar Sensors provides an analysis between the...

Smart and Flexible Digital-to-Analog Converters proposes new concepts and implementations for flexibility and self-correction of current-steering digital-to-analog converters (DACs) which allow the attainment of a wide range of functional and performance specifications, with a much reduced dependence on the fabrication process.

DAC linearity is analysed with respect to the accuracy of the DAC unit elements. A classification is proposed of the many different current-steering DAC correction methods. The classification reveals methods that do not yet exist in the open literature....

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.

The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The...

This book presents the latest understanding of the solid physics, electronic implications and practical applications of the unique spontaneous or pyro-electric polarization charge of hexagonal semiconductors, and the piezo-electric effects in thin film hetero-structures which are used in wide forbidden band gap sensor, electronic and opto-electronic semiconductor devices.

Verification Projects: Planning to Closure addresses the challenges of functional verification in the digital semiconductor market today. It presents best practices by alternately looking at the verification problem as a complete system, and expounding on the best practices for executing with the myriad of available verification technologies. As a result, the reader gains not only a sufficient knowledge to use each technology intelligently, but more importantly, knowledge of when each technology can be used most effectively, and how to combine the various...

In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, till recently, solders used in electronics, remained lead-based.

The worldwide multi-facetted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there...