Kategoria BISAC: Technology & Engineering >> Electronics - Microelectronics

Fully updated to address cutting-edge technologies, the new edition of this practical guide provides comprehensive, state-of-the-art coverage of RF and microwave power amplifier design. The book describes both existing and new schematic configurations, theoretical approaches, circuit simulation results, and implementation techniques.

New chapters discuss linearization and efficiency enhancement and high-efficiency Doherty power amplifiers. Featuring a systematic approach, this comprehensive resource bridges the theory and practice of RF and...

This book provides a hands-on introductory course on concepts of C programming using a PIC(R) microcontroller and CCS C compiler. Through a project-based approach, this book provides an easy to understand method of learning the correct and efficient practices to program a PIC(R) microcontroller in C language. Principles of C programming are introduced gradually, building on skill sets and knowledge. Early chapters emphasize the understanding of C language through experience and exercises, while the latter half of the book covers the PIC(R) microcontroller, its peripherals, and how to use...

• Contributions from leading authorities
• Informs and updates on all the...

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and...

Dedicated to SiC-based 1D nanostructures, this book explains the properties and different growth methods of these nanostructures. It details carburization of silicon nanowires, a growth process for obtaining original Si-SiC core-shell nanowires and SiC nanotubes of high crystalline quality, thanks to the control of the siliconout-diffusion. The potential applications of these particular nano-objects is also discussed, with regards to their eventual integration in biology, energy and electronics.

An optical cavity confines light within its structure and constitutes an integral part of a laser device. Unlike traditional gas lasers, semiconductor lasers are invariably much smaller in dimensions, making optical confinement more critical than ever. In this book, modern methods that control and manipulate light at the micrometer and nanometer scales by using a variety of cavity geometries and demonstrate optical resonance from ultra-violet (UV) to infra-red (IR) bands across multiple material platforms are explored.

The book has a comprehensive collection of chapters that...

Microsystems applications (MST) in automobiles have become commonplace: they enable the introduction of a series of new functions and at the same time the replacement of existing technologies offering improved performance and better value for money. Microsystems are indispensable for fulfilling a complete transition from the mechanically driven automobile system to a mechanically based but ICT-driven system as part of a likewise complex environment. With the introduction of micro-systems a series of challenges arise regarding complexity, systems design, reliability, serviceability, etc....

Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of...

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

In the past decades, the main stream of microelectronics progress has been mainly powered by Moore's law which focuses on IC miniaturization down to nanoscale. While the microelectronics community around the world continues to invent new solutions to keep Moore's law alive, there is a fast increasing need for non-digital and mixed-signal More than Moore (MtM) type technologies that are still based upon or derived from silicon technologies, but do not simply scale with Moore's law. Typical examples are devices incorporating RF, power/high voltage, passive components, sensors and actuators,...

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.

The book also includes exercises and...