Kategoria BISAC: Technology & Engineering >> Electronics - Microelectronics

In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, till recently, solders used in electronics, remained lead-based.

The worldwide multi-facetted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there...

Verification Projects: Planning to Closure addresses the challenges of functional verification in the digital semiconductor market today. It presents best practices by alternately looking at the verification problem as a complete system, and expounding on the best practices for executing with the myriad of available verification technologies. As a result, the reader gains not only a sufficient knowledge to use each technology intelligently, but more importantly, knowledge of when each technology can be used most effectively, and how to combine the various...

This book presents the latest understanding of the solid physics, electronic implications and practical applications of the unique spontaneous or pyro-electric polarization charge of hexagonal semiconductors, and the piezo-electric effects in thin film hetero-structures which are used in wide forbidden band gap sensor, electronic and opto-electronic semiconductor devices.

Analog Circuit Design is based on the yearly Advances in Analog Circuit Design workshop. The aim of the workshop is to bring together designers of advanced analogue and RF circuits for the purpose of studying and discussing new possibilities and future developments in this field. Selected topics for AACD 2007 are: (1) Sensors, Actuators and Power Drivers for the Automotive and Industrial Environment (Tue 27 March) - Chaired by Herman Casier, AMI Semiconductor Fellow, Belgium; (2) Integrated PA's from Wireline to RF (Wed 28 March) - Chaired by Prof. Michiel Steyaert, Catholic...

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.

The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The...

"Microelectronic Test Structures for CMOS Technology and Products" addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit...

Grid architectures, which are viewed as tools for the integration of distributed resources, play a significant role as managers of computational resources, but also as aggregators of measurement instrumentation and pervasive large-scale data acquisition platforms. The functionality of a grid architecture allows managing, maintaining, and exploiting hetereogeneous instrumentation and acquisition devices in a unifed way by providing standardized interfaces and common work environments to their users. This result is achieved through the properties of isolation from the physical network and...

Augmented Materials and Smart Objects investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects, particularly the requirements for integrated computation and MEMs sensors, System-in-a-package solutions, multi-chip modules, the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, as well as practical performance issues that are key to the AmI concept.

Also discussed are current requirements for realizing applications-oriented examples of...

The focus of this book is on the design of low voltage power MOSFETs and the relation between the device structure and the performance of a power MOSFET used as a switch in power management applications. Schematic illustrations simplify the discussion.