ilość książek w kategorii: 351
Elements of Stil: Principles and Applications of IEEE Std. 1450
ISBN: 9781461350897 / Angielski / Miękka / 291 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Standard - Test In. terface ____________________ Language So I was wrong. I was absolutely sure that by having an IEEE Standard defined, reviewed, and accepted, that I wouldn't need to write a book about it as well. The Standard would be the complete reference. And be aware - this book does not serve as a replacement to the IEEE Std. 1450 document. You should have a copy of the Standard as you go through this book. I realized that the Standard would not be the complete reference, about the time that the Working Group started to put notes into the draft proposa- notes to elaborate decisions in...
Standard - Test In. terface ____________________ Language So I was wrong. I was absolutely sure that by having an IEEE Standard defined, reviewed, and...
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cena:
585,00 zł |
Test Resource Partitioning for System-On-A-Chip
ISBN: 9781461354000 / Angielski / Miękka / 232 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Test Resource Partitioning for System-on-a-Chip is about test resource partitioning and optimization techniques for plug-and-play system-on-a-chip (SOC) test automation. Plug-and-play refers to the paradigm in which core-to-core interfaces as well as core-to-SOC logic interfaces are standardized, such that cores can be easily plugged into "virtual sockets" on the SOC design, and core tests can be plugged into the SOC during test without substantial effort on the part of the system integrator. The goal of the book is to position test resource partitioning in the context of... Test Resource Partitioning for System-on-a-Chip is about test resource partitioning and optimization techniques for plug-and-play ... |
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cena:
389,98 zł |
The Dynamics of Digital Excitation
ISBN: 9781461376347 / Angielski / Miękka / 276 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. The electronic circuit is a proud child of twentieth century natural science. In a hundred short years it has developed to the point that it now enhances nearly every aspect of human life. Yet our basic understanding of electronic-circuit operation, electronic -circuittheory, has not made significant progress during the semiconductor industry's explosive growth from 1950s to the present. This is because the electronic circuit has never been considered to be a challenging research subject by physi- cists. Linear passive circuit theory was established by the late 1940s. After the advent of the...
The electronic circuit is a proud child of twentieth century natural science. In a hundred short years it has developed to the point that it now enhan...
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cena:
389,98 zł |
Esd Testing: From Components to Systems
ISBN: 9780470511916 / Angielski / Twarda / 328 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Presenting information on electrostatic discharge (ESD) and the characterization of semiconductor devices, this book examines ESD physical models and discusses the test systems and testing and specifications of each model, including the RF ESD test systems and magnetic recording (MR) systems and latchup.
Presenting information on electrostatic discharge (ESD) and the characterization of semiconductor devices, this book examines ESD physical models and ...
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cena:
495,80 zł |
Through-Silicon Vias for 3D Integration
ISBN: 9780071785143 / Angielski / Twarda / 512 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. A comprehensive guide to TSV and other enabling technologies for 3D integration
Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field... A comprehensive guide to TSV and other enabling technologies for 3D integration
Written by an expert with more than 30 years of experience in the e... |
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cena:
968,58 zł |
Analog Filter and Circuit Design Handbook
ISBN: 9780071816717 / Angielski / Twarda / 640 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Cutting-edge techniques for designing analog filters and circuits With an emphasis on using operational amplifiers as key building blocks, Analog Filter and Circuit Design Handbook shows how to create working circuits that perform a variety of analog functions. Numerous circuit examples provide mathematical functions on analog signals in both a linear and nonlinear manner. The highly efficient elliptic-function filter response is featured throughout the book. Audio applications, such as audio power amplifiers and cross-over networks, are discussed, and both voltage and current feedback...
Cutting-edge techniques for designing analog filters and circuits With an emphasis on using operational amplifiers as key building blocks, Analog F...
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cena:
689,91 zł |
Linux for Embedded and Real-Time Applications
ISBN: 9780124159969 / Angielski / Miękka / 296 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This new edition of Linux for Embedded and Real-Time Applications provides a practical introduction to the basics and the latest developments in this rapidly evolving technology. Ideal for those new to using Linux in an embedded environment, it takes a hands-on approach and covers key concepts plus specific applications. Key features include:
This new edition of Linux for Embedded and Real-Time Applications provides a practical introduction to the basics and the latest development... |
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cena:
177,30 zł |
Digital Systems Design with FPGAs and Cplds
ISBN: 9780750683975 / Angielski / Twarda / 724 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Digital Systems Design with FPGAs and CPLDs explains how to design and develop digital electronic systems using programmable logic devices (PLDs). Totally practical in nature, the book features numerous (quantify when known) case study designs using a variety of Field Programmable Gate Array (FPGA) and Complex Programmable Logic Devices (CPLD), for a range of applications from control and instrumentation to semiconductor automatic test equipment. Key features include: * Case studies that provide a walk through of the design process, highlighting the trade-offs involved.
*... Digital Systems Design with FPGAs and CPLDs explains how to design and develop digital electronic systems using programmable logic devices (PLD...
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cena:
347,11 zł |
Design, Simulation and Applications of Inductors and Transformers for Si RF ICS
ISBN: 9780792379867 / Angielski / Twarda / 190 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency range. One tool which has assisted designers in satisfying these requirements is the use of on-chip inductiveelements (inductors and transformers) in silicon (Si) radio-frequency (RF) integrated circuits (ICs). These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Inductors can be used to improve the intermodulation...
The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency ran...
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cena:
702,00 zł |
Make: Getting Started with Sensors: Measure the World with Electronics, Arduino, and Raspberry Pi
ISBN: 9781449367084 / Angielski / Miękka / 140 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. To build electronic projects that can sense the physical world, you need to build circuits based around sensors: electronic components that react to physical phenomena by sending an electrical signal. Even with only basic electronic components, you can build useful and educational sensor projects. To build electronic projects that can sense the physical world, you need to build circuits based around sensors: electronic components that react t... |
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cena:
85,29 zł |
Power Distribution Networks in High Speed Integrated Circuits
ISBN: 9781461350576 / Angielski / Miękka / 280 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have become commonplace while the power supply is plunging toward one volt. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.
Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have becom...
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cena:
623,99 zł |
Design, Simulation and Applications of Inductors and Transformers for Si RF ICS
ISBN: 9781475773668 / Angielski / Miękka / 190 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency range. One tool which has assisted designers in satisfying these requirements is the use of on-chip inductiveelements (inductors and transformers) in silicon (Si) radio-frequency (RF) integrated circuits (ICs). These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Inductors can be used to improve the intermodulation...
The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency ran...
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cena:
780,00 zł |
Digital Radio Systems on a Chip: A Systems Approach
ISBN: 9781475774733 / Angielski / Miękka / 518 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This book focuses on a specific engineering problem that is and will continue to be important in the forth-coming information age: namely, the need for highly integrated radio systems that can be embedded in wireless devices for various applications, including portable mobile multimedia wireless communications, wireless appliances, digital cellular, and digital cordless. Traditionally, the design of radio IC's involves a team of engineers trained in a wide range of fields that include networking, communication systems, radio propagation, digital/analog circuits, RF circuits, and process...
This book focuses on a specific engineering problem that is and will continue to be important in the forth-coming information age: namely, the need fo...
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cena:
897,02 zł |
Soi Design: Analog, Memory and Digital Techniques
ISBN: 9781475775624 / Angielski / Miękka / 392 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This title introduces state-of-the-art design principles for SOI circuit design, and is primarily concerned with circuit-related issues. It considers SOI material in terms of implementation that is promising or has been used elsewhere in circuit development, with historical perspective where appropriate. This title introduces state-of-the-art design principles for SOI circuit design, and is primarily concerned with circuit-related issues. It conside... |
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cena:
585,00 zł |
Writing Testbenches: Functional Verification of Hdl Models
ISBN: 9781475783445 / Angielski / Miękka / 354 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. CHAPTER 6 Architecting Testbenches 221 Reusable Verification Components 221 Procedural Interface 225 Development Process 226 Verilog Implementation 227 Packaging Bus-Functional Models 228 Utility Packages 231 VHDL Implementation 237 Packaging Bus-Functional Procedures 238 240 Creating a Test Harness 243 Abstracting the Client/Server Protocol Managing Control Signals 246 Multiple Server Instances 247 Utility Packages 249 Autonomous Generation and Monitoring 250 Autonomous Stimulus 250 Random Stimulus 253 Injecting Errors 255 Autonomous Monitoring 255 258 Autonomous Error Detection Input and...
CHAPTER 6 Architecting Testbenches 221 Reusable Verification Components 221 Procedural Interface 225 Development Process 226 Verilog Implementation 22...
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cena:
389,98 zł |
High Frequency Continuous Time Filters in Digital CMOS Processes
ISBN: 9781475784299 / Angielski / Miękka / 214 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. There is an ever increasing trend towards putting entire systems on a single chip. This means that analog circuits will have to coexist on the same substrate along with massive digital systems. Since technologies are optimized with these digital systems in mind, designers will have to make do with standard CMOS processes in the years to come. We address analog filter design from this perspective. Filters form important blocks in applications ranging from computer disc-drive chips to radio transceivers. In this book, we develop the theory and techniques necessary for the implementation of high...
There is an ever increasing trend towards putting entire systems on a single chip. This means that analog circuits will have to coexist on the same su...
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cena:
389,98 zł |
Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research
ISBN: 9789814579780 / Angielski / Twarda / 472 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of...
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminar...
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cena:
760,10 zł |
IC Interconnect Analysis
ISBN: 9781475776744 / Angielski / Miękka / 310 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of their relevance to the overall circuit behavior, the interconnect can now have a dominant impact on the IC area and performance. Beginning in the late 1980's there was significant research toward better modeling and characterization of the resistance, capacitance and ultimately the inductance of...
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shif...
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cena:
585,00 zł |
CMOS and Beyond: Logic Switches for Terascale Integrated Circuits
ISBN: 9781107043183 / Angielski / Twarda / 436 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Get up to speed with the future of logic switch design with this indispensable overview of the most promising successors to modern CMOS transistors. Learn how to overcome existing design challenges using novel device concepts, presented using an in-depth, accessible, tutorial-style approach. Drawing on the expertise of leading researchers from both industry and academia, and including insightful contributions from the developers of many of these alternative logic devices, new concepts are introduced and discussed from a range of different viewpoints, covering all the necessary theoretical...
Get up to speed with the future of logic switch design with this indispensable overview of the most promising successors to modern CMOS transistors. L...
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cena:
329,32 zł |
3D IC Integration and Packaging
ISBN: 9780071848060 / Angielski / Twarda / 480 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. A comprehensive guide to 3D IC integration and packaging technology
3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers,... A comprehensive guide to 3D IC integration and packaging technology
3D IC Integration and Packaging fully explains the latest microel... |
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cena:
1071,39 zł |