Kategoria BISAC: Computers >> Embedded Computer Systems

This textbook teaches students techniques for the design of advanced digital systems using Field Programmable Gate Arrays (FPGAs). The authors focus on communication between FPGAs and peripheral devices (such as EEPROM, analog-to-digital converters, sensors, digital-to-analog converters, displays etc.) and in particular state machines and timed state machines for the implementation of serial communication protocols, such as UART, SPI, I²C, and display protocols, such as VGA, HDMI. VHDL is used as the programming language and all topics are covered in a structured, step-by-step...

This book introduces several novel approaches to pave the way for the next generation of integrated circuits, which can be successfully and reliably integrated, even in safety-critical applications. The authors describe new measures to address the rising challenges in the field of design for testability, debug, and reliability, as strictly required for state-of-the-art circuit designs. In particular, this book combines formal techniques, such as the Satisfiability (SAT) problem and the Bounded Model Checking (BMC), to address the arising challenges concerning the increase in test data...

This book provides comprehensive coverage of Network-on-Chip (NoC) security vulnerabilities and state-of-the-art countermeasures, with contributions from System-on-Chip (SoC) designers, academic researchers and hardware security experts. Readers will gain a clear understanding of the existing security solutions for on-chip communication architectures and how they can be utilized effectively to design secure and trustworthy systems. 

This book describes recent findings in the domain of Boolean logic and Boolean algebra, covering application domains in circuit and system design, but also basic research in mathematics and theoretical computer science. Content includes invited chapters and a selection of the best papers presented at the 14^th annual International Workshop on Boolean Problems.

Globalization of the integrated circuit (IC) supply chains led to many potential vulnerabilities. Several attack scenarios can exploit these vulnerabilities to reverse engineer IC designs or to insert malicious trojan circuits.

Split manufacturing refers to the process of splitting an IC design into multiple parts and fabricating these parts at two or more foundries such that the design is secure even when some or all of those foundries are potentially untrusted. Realizing its security benefits, researchers have proposed split fabrication methods for 2D, 2.5D, and the emerging 3D...

This book provides readers with an introduction to the materials and devices necessary for flexible sensors and electronics, followed by common techniques for fabrication of such devices and system-level integration. Key insights into fabrication and processing will guide readers through the tradeoff choices in designing such platforms. A comprehensive review of two specific, flexible bioelectronic platforms, related to smart bandages for wound monitoring and thread-based diagnostics for wearable health, will demonstrate practical application at the system level.  The book also...

This book describes the role of magnetism in electrical engineering, starting from the most basic laws of physics, converted into simulation models such that electrical engineering students can learn by example and practice. The author demystifies a topic that many electrical engineers take for granted, providing readers the tools to be able to understand how any magnetic component works. He describes magnetic components like inductors and transformers in simple understandable language. Mathematical equations related to the basic laws of physics are described in detail along with the...

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an...