This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and...

Microfluidics-based biochips combine electronics with biochemistry, providing access to new application areas in a wide variety of fields. Continued technological innovations are essential to assuring the future role of these chips in functional diversification in biotech, pharmaceuticals, and other industries. Revolutionary guidance on design, optimization, and testing of low-cost, disposable biochips Microfluidic Biochips: Design Automation and Optimization comprehensively covers the appropriate design tools and in-system automation methods that will help users adapt to new...