Thermal design in electronics cooling is to achieve effective heat removal to increase reliability and life of the components and systems. This book focuses on cooling of a Flip Chip (FC) package without the use of phase change materials(PCM). A numerical thermal model was developed and validated. CFD Simulation is performed for PCM and non-PCM based material studies. Relevant thermal performance data were obtained to show the effects of thermal interface material, lid, heat sink and process variables. Excellent agreement found between the numerical and the measured data. A novel PCM-based...