In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a huge amount of heat during operation poses a great thermal management challenge because reliable operation temperature for electronic devices has to be maintained. In most cases, the maximum electronic device junction temperature needs to be held at less than 85°C for reliable operation. The maximum heat flow from a high-performance electronic package can be about 200 W and...

Numerous studies have been conducted to design facility layouts since the early 1950s. The majority of these studies have primarily focused on product layout, functional layout, cellular layout, or their variants. The recent trend in manufacturing systems literature establishes the consensus that these conventional configurations do not meet the needs of today's multi-product enterprises work- ing in a dynamic environment. A promising approach to address changes in the production environment is to build facility layouts that can easily adapt to volatilities. Distributed layouts are among such...

The study of reduced graphene oxide as nanofluid with the base fluid of volume fraction (10%Vol) was prepared to perform the thermal investigation on the solar parabolic trough collector receiver model. The peak intensity of nanoparticle size distribution and crystal structure behavior was employed by transmission electronic microscopy (TEM) and X-ray diffractometer (XRD) techniques. In order to enhance the thermal performance of the receiver model between evacuated and non-evacuated conditions is established. For testing of physical parameters of Reynolds number, friction factor, and average...