This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of...

This book presents a method that allows the use of multiresolution principles in a time domain electromagnetic modeling technique that is applicable to general structures. The multiresolution time-domain (MRTD) technique, as it is often called, is presented for general basis functions. Additional techniques that are presented here allow the modeling of complex structures using a subcell representation that permits the modeling discrete electromagnetic effects at individual equivalent grid points. This is accomplished by transforming the application of the effects at individual points in the...

This book presents a step-by-step discussion of the design and development of radio frequency identification (RFID) and RFID-enabled sensors on flexible low cost substrates for UHF frequency bands. Various examples of fully function building blocks (design and fabrication of antennas, integration with ICs and microcontrollers, power sources, as well as inkjet-printing techniques) demonstrate the revolutionary effect of this approach in low cost RFID and RFID-enabled sensors fields. This approach could be easily extended to other microwave and wireless applications as well. The first chapter...