Practically all microelectronics assemblies in use utilize Sn-Pb eutectic solder for interconnections. Owing to worldwide environmental legislation to ban toxic materials in solder and demands for green products , a variety of lead-free solders have been developed. Sn-Ag-Cu solder is one of the most suitable candidates to replace lead solders. However, the performance of Sn-Ag-Cu alloys is not considered good enough to meet all needs to be for a solder material. To improve the solder material properties, a fourth element, Zn, is added into the solder alloy. This book describes some properties...