The two most important trends in electronic industry are "miniaturisation" and "increased functionality". As these trends are set to continue, there is an increasing demand for better understanding of soldering technology, particularly in the area of solder pastes used in the reflow soldering of surface mount devices. This means that the paste flow and deformation behaviour is very important in defining the printing performance of any solder paste. The work reported in this book is focused on experimetal investigation and empirical modelling of time-dependent rheological behaviours...