Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. Emerging environmental regulations worldwide have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable Pb-free solders an important issue for microelectronics assembly. This book describes some properties of Sn-9Zn and Sn-8Zn-3Bi lead-free solders interacting with copper substrate. Some information are given on the wetting behavior, the interfacial reaction, mechanical properties and growth...