In recent years there has been an increasing demand for low-T packaging technologies to vacuum seal MEMS devices at the wafer level. When caps are fabricated using standard surface micromachining techniques, the need for wafer bonding alignment equipment is eliminated. This book presents the different processing steps of a new surface micromachining module for MEMS packaging at temperatures 180 C based on electroplating and resist sacrificial layers. Sacrificial etch holes are situated above the device allowing shorter release times. Analytical and FEA methods are used to understand, to...