As System-on-Chip (SoC) has become more pervasive in recent years, the substrate noise coupling problem has become an increasing challenge in mixed-signal IC design. This book provides a thorough understanding of substrate noise generation mechanisms, 3D substrate modeling, and substrate noise suppression techniques. Furthermore, an active noise suppression technique, developed by the author, is presented in detail, including the theory analysis, 3D substrate and isolation structures modeling, simulation methodology, test site design, and data analysis. At the end, an insightful discussion is...
As System-on-Chip (SoC) has become more pervasive in recent years, the substrate noise coupling problem has become an increasing challenge in mixed-si...
