I/O bandwidth in the Multi-Tb/s range is
required for current and future high performance VLSI chips.
This trend demands high-speed, high-density and low power
I/Os. AC coupled interconnect (ACCI) has been demonstrated
as a systematic solution for providing higher pin density
and lower power dissipation. ACCI utilizes non-contact
capacitor plates as signal I/O which yields a much higher
pin density than traditional solder bump I/O. ACCI saves
significant power with pulse signaling. A test-chip with...