In electronic cooling, the generated heat may be rejected via air, water, or phase change materials. The inherent advantages of air cooling systems such as simplicity, reliability, and low cost have led to the widespread use of heat sinks in the thermal management of high power microprocessors. Among the different designs of the commonly used heat sinks are the finned- plate heat sinks. The choice of an optimum finned- plate heat sink depends on various geometrical parameters such as fin height, fin length, fin thickness, number of fins, base plate thickness, space between fins, fin shape or...