Vertically-integrated 3D Multiprocessor Systems-on-Chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs are subject to amplified thermal challenges that undermine the corresponding reliability. To address these issues, several advanced cooling technologies alongside temperature-aware design-time optimizations and run-time management schemes have been proposed. Temperature-Aware Design and Management for 3D Multi-Core Architectures surveys recent advances in...
Vertically-integrated 3D Multiprocessor Systems-on-Chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area wh...