The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

This book, discusses the latest research on the intelligent control of two important components in smart grids, namely microgrids (MGs) and electric vehicles (EVs).