Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by the Technical University of Budapest, Budapest, Hungary, on May 18-20, 1995. Additionally, the Hungarian Chapter of ISHM-The Microelectronics...