Silver interconnection has superior performance than current interconnection materials/techniques, including conductive adhesives and reflowed solders; but high processing temperature prevent its application. With the large external pressure, the micro-scale silver paste can be sintered to form high-quality interconnection layer at 240oC. The external pressure, however, makes this technique difficult to implement. Because nanoscale silver particles have lower sintering temperature, several approaches were developed to address sintering challenges of nanoscale silver particles, such as...