With the scaling of devices, integration of porous
ultra low-k materials into Cu interconnect becomes
imperative. Low-k dielectric materials consist of
methyl groups and pores incorporated into a silicon
dioxide backbone structure to reduce the dielectric
constant. Plasma is widely used in semiconductor
industry for deposition, etching, stripping etc.
This book explores the interaction between plasma
and low-k dielectric materials and their application
in advanced semiconductor processes. It mainly
consists of two parts. First, plasma assists the
atomic layer deposition of Ta based...