This book provides a framework for real time control of the Chemical Mechanical Planarization (CMP) process based on combining nonlinear dynamics principles with statistical process monitoring approaches. CMP has a direct bearing on the computational speed and dimensional characteristics of solid state devices. The challenge in CMP may be narrowed to domains enveloping productivity, measured in terms of material removal rate (MRR), and quality which is usually specified in terms of surface roughness - Ra, within wafer non-uniformity (WIWNU), defect rate, etc. In this work, experimental...