With the increasing scalability of semiconductor processes, the higher level of functional integration at the die level, and the system integration of different technologies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration technology, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic, analog/mixed-signal, memory, and passive and discrete components in a single system.System-in-Package: Electrical and Layout Perspectives focuses on electrical and layout perspectives, as opposed to...
With the increasing scalability of semiconductor processes, the higher level of functional integration at the die level, and the system integration of...
As the first book to introduce and analyze cultural studies in contemporary China, this volume is an important resource for Western scholars wishing to understand the rise and development of cultural studies in China.
As the first book to introduce and analyze cultural studies in contemporary China, this volume is an important resource for Western scholars wishing t...
